Qualcomm Announce New Architectures For Immersive Experiences With Snapdragon 845 Mobile Platform

When it comes to supporting augmented reality (AR), virtual reality (VR) and increasingly mixed reality (MR) projects it’s not just the platform stakeholders who have been busy working to improve things in the hardware department. A number of other technology firms have also been hard at work, with perhaps the three most notable being NVIDIA, Intel, and Qualcomm.
For the latter 2017 has seen them involved in many avenues. Including working with Mastercard on an AR retail platform, announcing a 3D depth sensing technology with Himax, being involved with the HTC Vive standalone headset, now known as the Vive Focus. Partnering with Ximmerse on mobile VR, and also with Tencent on their head mounted display (HMD) to name but a few. It was also back in January it was revealed the Snapdragon 835 processor would be aimed at mobile VR and AR.
That was the beginning of the year however and Qualcomm has just announced the introduction of a new mobile platform the Snapdragon 845 and once again immersive technologies are set to play a part in its thinking. Snapdragon 845 utilising the company’s experience in areas such as artificial intelligence and what it terms ‘XR’ – eXtended reality.
Qualcomm’s Senior Vice President and General Manager of Mobile, Alex Katouzian, said “As leaders in mobile technology, we will transform the mobile experience with comprehensive advancements in visual processing, AI, security and connectivity. The Snapdragon 845 Mobile Platform is the next horizon of innovation and is going to transform the way people use their mobile devices to make their lives better.”
Qualcomm say that the Snapdragon 845 Mobile Platform “was designed for consumers to capture cinema-grade videos and blur the lines between physical and virtual worlds.” For increased benefit with immersive platforms it points to the new Adreno 630 visual processing subsystem architecture which covers AR, VR and MR and which, it claims, will “transform entertainment, education and social interaction, making them more immersive and intuitive” .
The Snapdragon 845 Mobile Platform is expected to begin shipping to the general public in mobile devices early next year. VRFocus will bring you more news on that in 2018. For now you can find details on the Snapdragon 845 Mobile Platform below and more information on the Qualcomm website.
Qualcomm Spectra 280 ISP

Ultra HD premium capture
Qualcomm Spectra Module Program, featuring Active Depth Sensing
MCTF video capture
Multi-frame noise reduction
High performance capture up to 16MP @60FPS
Slow motion video capture (720p @480 fps)
ImMotion computational photography

Adreno 630 Visual Processing Subsystem

30% improved graphics/video rendering and power reduction compared to previous generation
Room-scale 6 DoF with SLAM
Adreno foveation, featuring tile rendering, eye tracking, multiView rendering, fine grain preemption
2K x 2K @ 120Hz, for 2.5x faster display throughput
Improved 6DoF with hand-tracking and controller support

Qualcomm® Hexagon™ 685 DSP

3rd Generation Hexagon Vector DSP (HVX) for AI and imaging
3rd Generation Qualcomm All-Ways AwareTM Sensor Hub
 Hexagon scalar DSP for audio

Snapdragon X20 LTE modem

Support for 1.2 Gbps Gigabit LTE Category 18
License Assisted Access (LAA)
Citizens Broadband Radio Service (CBRS) shared radio spectrum
Dual SIM-Dual VoLTE (DSDV)

Connectivity

Multigigabit 11ad Wi-Fi with diversity module
Integrated 2×2 11ac Wi-Fi with Dual Band Simultaneous (DBS) support
11k/r/v: Carrier Wi-Fi enhanced mobility, fast acquisition and congestion mitigation
Bluetooth 5 with proprietary enhancements for ultra-low power wireless ear bud support and direct audio broadcast to multiple devices

Secure Processing Unit

Biometric authentication (fingerprint, iris, voice, face)
User and app data protection
Integrated use-cases such as integrated SIM, Payments, and more

Qualcomm Aqstic Audio

Qualcomm Aqstic audio codec(WCD934x):

Playback:

Dynamic range: 130dB, THD+N: -109dB
Native DSD support (DSD64/DSD128), PCM up to 384kHz/32bit
Low power voice activation: 0.65mA

Record:

Dynamic range: 109dB, THD+N: -103dB
Sampling: Up to 192kHz/24bit

Qualcomm® Quick Charge™ 4+
Kryo 385 CPU

Four performance cores up to 2.8GHz (25 percent performance uplift compared to previous generation)
Four efficiency cores up to 1.8GHz
2MB shared L3 cache (new)
3MB system cache (new)

10-nanometer (nm) LPP FinFET process technology

Source: Qualcomm Announce New Architectures For Immersive Experiences With Snapdragon 845 Mobile Platform